BE Semiconductor Industries N.V. (Besi)

BE Semiconductor Industries N.V., Besi for short, is a Dutch company that develops semiconductor assembly equipment. According to the company, it is headquartered in Duiven, the Netherlands; its ordinary shares trade on Euronext Amsterdam under the ticker BESI.

After a chip is produced on a silicon wafer, it has to be separated from the wafer, placed on a substrate, bonded and encapsulated; Besi makes equipment for these back-end assembly processes. Its product range covers die attach systems that place chips precisely, encapsulation and packaging equipment, and plating systems. The company stands out in particular for hybrid bonding technology, which connects chips directly to one another without using solder and is used in advanced packaging applications such as AI processors and high-bandwidth memory. Its products serve markets such as electronics, mobile devices, cloud servers, automotive and industrial.

Those following Besi track advanced packaging investment, customer adoption of hybrid bonding systems, the cycle in main markets such as smartphones and automotive, and swings in orders. The Besi page on Lzzo.com presents the price in Amsterdam on a US dollar basis; the Turkish lira, euro or pound sterling equivalent can also be displayed. A historical price chart, technical indicators, the source of the data and the time of the last update are also on the page.